Influence of process parameters on the bonding performance of wood adhesive based on thermally modified soy proteinsVnučec Paušner, Doroteja (Avtor) Mikuljan, Marica (Avtor) Kutnar, Andreja (Avtor) Šernek, Milan (Avtor) Goršek, Andreja (Avtor) adhesive bondingtensile strengthsoy proteins20162016-08-03 04:07:16Delo ni kategorizirano8338ISSN: 0018-3768UDK: 674OceCobissID: 6138375DOI: 10.1007/s00107-016-1018-1COBISS.SI-ID: 1538191812sl