Numerical modeling of wood-adhesive bond-line in mode ii for spruce wood glued by various adhesivesSebera, Václav (Avtor) Pečnik, Jaka Gašper (Avtor) Azinović, Boris (Avtor) Kramar, Miha (Avtor) mode IIspruce woodfinite element analysiscrack propagationadhesive bond20192019-10-16 11:13:50Neznano11982UDK: 630*8OceCobissID: 1541549764COBISS.SI-ID: 1541550020sl