Numerical modeling of wood-adhesive bond-line in mode ii for spruce wood glued by various adhesives

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Title:	Numerical modeling of wood-adhesive bond-line in mode ii for spruce wood glued by various adhesives
Authors:	ID Sebera, Václav (Author) ID Pečnik, Jaka Gašper (Author) ID Azinović, Boris (Author) ID Kramar, Miha (Author)
Files:	http://www.innovawood.com/LinkClick.aspx?fileticket=%2B9l8tAY3IEM%3D&tabid=230
Language:	English
Work type:	Unknown
Typology:	1.12 - Published Scientific Conference Contribution Abstract
Organization:	IAM - Andrej Marušič Institute
Keywords:	mode II, spruce wood, finite element analysis, crack propagation, adhesive bond
Year of publishing:	2019
Number of pages:	Str. 52-53
PID:	20.500.12556/RUP-11982
UDC:	630*8
COBISS.SI-ID:	1541550020
Publication date in RUP:	16.10.2019
Views:	2141
Downloads:	50
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Title:	Book of abstracts
Place of publishing:	Skopje
Publisher:	Ss. Cyril and Methodius University
Year of publishing:	2019
COBISS.SI-ID:	1541549764

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