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Title:Numerical modeling of wood-adhesive bond-line in mode ii for spruce wood glued by various adhesives
Authors:ID Sebera, Václav (Author)
ID Pečnik, Jaka Gašper (Author)
ID Azinović, Boris (Author)
ID Kramar, Miha (Author)
Files:URL http://www.innovawood.com/LinkClick.aspx?fileticket=%2B9l8tAY3IEM%3D&tabid=230
 
Language:English
Work type:Unknown
Typology:1.12 - Published Scientific Conference Contribution Abstract
Organization:IAM - Andrej Marušič Institute
Keywords:mode II, spruce wood, finite element analysis, crack propagation, adhesive bond
Year of publishing:2019
Number of pages:Str. 52-53
PID:20.500.12556/RUP-11982 This link opens in a new window
UDC:630*8
COBISS.SI-ID:1541550020 This link opens in a new window
Publication date in RUP:16.10.2019
Views:1695
Downloads:49
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Record is a part of a monograph

Title:Book of abstracts
Place of publishing:Skopje
Publisher:Ss. Cyril and Methodius University
Year of publishing:2019
COBISS.SI-ID:1541549764 This link opens in a new window

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